DESCRIPTION

A Printed Circuit Board consisting of multiple layers that is used as a conduit to transfer data, information and power to components within an electronics chassis/sever that supports “box-build” applications.

FEATURES AND BENEFITS

• Ease of assembly as circuit 1 and 1,000 are built with the same tooling guaranteeing reproducibility
• Larger sized backplanes eliminates “jumper” cabling within a chassis improving reliability, lowers assembly cost and creates stronger signal integrity
• High performance materials for high speed digital applications
• Wide range of material selections to suit the design from power to high-speed (56gb) applications
• Copper weight variability to carry high speed signal or power within one design
• Precision back-drilling for high-speed signal integrity